Neuroelectronics

In this theme, we aim to develop multifunctional, scalable neuroelectronics and build next-generation tools and biomedical devices for various applications, such as brain activity mapping, diagnosis and treatment of neurological disorders, and neuroprosthetics. A recent example is developing functional nanomesh based transparent and soft neural interfaces. We have demonstrated that by stacking individual layers of metal, and low-impedance coating reliably in a same nanomeshed pattern, the final bilayer nanomesh achieved system-level performance from both individual layers, in addition to nanomesh advantages.

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Representative contributions

1. Nanomesh-based neuroelectronics. The Fang group has pioneered nanomesh-based electrophysiology microelectrodes with their scaling studies (ACS Nano, 2017); Coined and validated a functional bilayer nanomesh concept (Advanced Functional Materials, 2017) for high-performance transparent bio-electronics (Science Advances, 2018; Advanced Biosystems, 2019). By stacking individual layers with different desired mechanical, electrical, and electrochemical properties in a same nanomeshed pattern and with reliable interfaces, we achieved functional nanomeshed multilayer with system-level performance from all individual layers, in addition to the softness and transparency from the nanomesh design. Together, these results demonstrate the applicability of using nanomesh under biological conditions and broad applications in biology and medicine.

2. Flexible CMOS-based bioelectronics. We previously developed a capacitively-coupled-sensing device platform that deploys nanoscale thickness thermally-grown SiO₂ as the encapsulation layer for flexible CMOS bioelectronics, with a projected lifetime of multi decades while implanted (PNAS, 2016; Advanced Electronic Materials, 2017). Demonstrated highly scaled, actively multiplexed, flexible Si electronics with 396 electrodes and only 58 wires fabricated from this sensing scheme and successfully applied to map the activity from the surface of the brain in vivo, and the heart ex vivo (Nature Biomedical Engineering, 2017). This work paved the way for minimally invasive, implantable electronics. In addition, Fang has established the foundations for realistically integrating commercial CMOS for rapid assembly and electrical interconnection on soft, biocompatible polymer substrates (PNAS, 2017).