Magnetic components.

Equipment

Deposition

Parylene Coater – Diener Electronic Parylene P6

Parylene Coating System

Parylene Coater.

Overview

System for depositing Parylene polymers

Features

Thickness range is 0.05um to 20um

Operating Instructions

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Sputter – Cooke C71-3M

Sputtering System

Sputtering system.

Overview

Vacuum sputtering system for thin film deposition, featuring DC sputter guns and cooled/heated target

Features

  • Manual system
  • 2 US Gun II guns
  • MDX Magnetron drive
  • Substrate heater
  • Adjustable sputtering orientation using vertical and/or horizontal mounts

Specifications

  • Guns (2)
    • target size: 2 in diameter
    • target thickness: 1/32″-1/4″
    • Nominal operating pressure: 5μ argon
  • Mass flow valve (3): 0 to 50 sccm, O2, N2, Ar
  • SS cylinder: 4″ view port

Operating Instructions

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Instructions

Door latch must swing fully to side to release door

Company

Model: C71-3M

Name: Cooke Vacuum Products

Email: info@cookevacuum.com

Address: 46 Chestnut Street, South Norwalk, CT 06854

Phone: 203-853-9500

Sputter – Denton Explorer 14

Sputtering System

Sputtering system.

Overview

Vacuum sputtering system for thin film deposition

Research Equipment

Sullivan Group Research Equipment
For use by others only with permission of Prof. Charlie Sullivan (Charles.R.Sullivan@dartmouth.edu)

Features

  • Operation Modes: Manual, Auto, Maintenance
  • Allows operation of multiple sputter sources and RF bias source
  • Ability to heat and rotate substrates
  • Windows XP Professional operating system
  • ProcessPro Control Software
  • GE-Fanuc VERSAMAX programmable logic controller interfaced to system host computer

Specifications

  • Deposition chamber: Discovery SJ/14; 12” (high) x 14” (wide) x 14”(deep)
  • Pumping system:
    • CTI Cryogenics CT-8 cryogenic pump
    • CTI Cryogenics water-cooled compressor with helium lines.
    • Pfeiffer Duo 10 two-stage, rotary vane pump (7 CFM)
  • Sputter source: (3) 2.0” diameter, internal stalk-mount, ?US Gun?, planar magnetron
  • RF-bias substrate stage: 6.0″ substrate platen; pre-machined to accept DVI 150 mm sample transfer holder
  • Substrate heat: (2) 1.0 kW, backside quartz heater arrays with reflector and deposition shield

Images

Schematic of sputtering system from the left side, front side, right side, and top view.

Operating Instructions

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Company

Model: Explorer-14

Name: Denton Vacuum-USA

Email: info@dentonvacuum.com

Address: 1259 North Church St. Bldg 3, Moorestown, NJ 08057

Phone: 800-666-6004

Electron Microscopy

Electron Microscopy – SEM, FIB-SEM, TEM, EDS, EBSD, etc.

Electron Microscope Facility

Dual Beam Focused Ion Beam and Scanning Electron Microscope System.

Overview

Microengineering Lab users utilize the Dartmouth Electron Microscope Facility for SEM, FIB, TEM, EDS, EBSD, and other capabilities.

Features

The Electron Microscope Facility web page contains details on capabilities and equipment models.

Etch

Fume Hoods for Acids, Organics, & RCA Cleans – Plastic Design Inc

Fume Hoods

Fume hood.

Overview

There are three laminar flow fume hoods.  One hood is for organics (eg. photoresist stripping and solvents), one is dedicated to RCA cleans, and one for general acid and base processing.

Operating Instructions

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Plasma Cleaner – Harrick PDC-001

Plasma Cleaner

Plasma cleaner.

Overview

Tabletop inductively coupled RF plasma chamber for photoresist descum, surface cleaning, surface preparation for bonding, and surface modification of metals, ceramics, composites, plastics, polymers and biomaterials. Setup for oxygen or air plasma.

Safety/Warnings

Qualified users only. Use only the provided dry pump (oil pumps with oxygen are an explosion hazard).

Features

  • Compact, tabletop unit
  • Low, Medium, and High RF power settings
  • Includes a 6″ diameter by 6 1/2″ long Pyrex chamber and an integral switch for a vacuum pump
  • hinged cover features a magnetic closure and a viewing window
  • 1/8″ NPT needle valve to control gas flow and chamber pressure
  • 1/8″ NPT 3-way valve to quickly switch from bleeding in gas, isolating the chamber, and venting
  • Edwards XDS Dry Pump
  • May be used with oxygen process gas
  • Contributes no lubricant vapors to the vacuum chamber
  • Bearings are isolated from the vacuum environment by a patented XDS bearing shield
  • Versatile pump uses a scroll mechanism manufactured by BOC Edwards
  • Low vibration and noise levels make it ideal for laboratory use

Specifications

  • Applies 7.2, 10.2 or 29.6 Watts (L, M, or H) to the RF coil
  • Weight: 45 lbs
  • Size: 11″H x 18″W x 9″D

Operating Instructions

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Company

Model: PDC-001

Name: Harrick Plasma

Address: 120 Brindley St, Ithaca, NY 14850

Phone: 800-640-6380

Year of Purchase: 2008

PO Number: 1026835

RIE – Plasma Sciences RIE- 600W

Reactive Ion Etcher

Reactive Ion Etcher.

Overview

Capacitively coupled plasma etch system set up with oxygen and fluorinated gas

Safety/Warnings

Use only the provided pump with PFPE fluorinated lubricant (conventional hydrocarbon oil pumps with oxygen are an explosion hazard)

Features

Process gasses are CF4, O2, Ar, N2

Operating Instructions

JMI Plasma Etch SOP

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Lithography

Electron Beam Lithography – JC Nabity Lithography Systems NPGS

Electron Beam Lithography

Dual Beam Focused Ion Beam and Scanning Electron Microscope System.

Overview

E-beam lithography is performed on a Thermo Scientific Helios 5CX Dual Beam SEM/FIB System with a fast beam blanker controlled by a Nanometer Pattern Generation System (NPGS)

Equipment Location

E-beam lithography resides in the Dartmouth Electron Microscope Facility

Vendor

Hotplates

Hotplates – Photoresist Processing

Two hot plates.

Overview

Hotplates for use in photoresist processing

Specifications

  • Thermo Scientific 300C maximum
  • Dataplate 370C maximum

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Mask Aligner – Karl Suss MJB3 UV400

Mask Aligner

Mask aligner.

Overview

Photolithographic contact mask aligner transfers a pattern from a chrome/glass mask to a photoresist coated wafer by exposing the stack to ultraviolet light.

Safety/Warnings

The UV lamp is under high pressure when hot; do not open its explosion proof housing or attempt to change the bulb. Do not restart a hot bulb until it has cooled for half an hour.

Features

  • Printing down to 0.8um
  • Handles up to 75 mm (3″ wafers) diameter substrate
  • Uses 4″ mask
  • High precision X, Y, alignment stage and microscope manipulator
  • Hard, Soft, and Vacuum contact modes
  • Microscope Objectives (NA=Numerical Aperture, WD=working distance, FOV=field of view, DOF=depth of focus, RL=Rayleigh Limit resolution@500nm):
    • 10x, 0.2NA 17mmWD 1.8mmFOV 15umDOF 1.5umRL
    • H20x 0.4NA 8.2mmWD, .9mmFOV 4umDOF .8umRL thru mask optimized
    • H35x 0.6NA 4.0mmWD .6mmFOV 4umDOF .5umRL thru mask optimized

Specifications

See attached Data Sheet

  • Normal field microscope.
  • 350W Hg lamp.
  • Lamp produces 365 nm (i-line), 405 nm (h-line), and 435 nm (g-line); system can be used with a broad spectrum or with an optional filter for i-line spectrum; CI2 measures only power at 405nm and CI1 measure only power at 365nm; total UV is higher.

Images

Plot of light intensity verses wavelength for a mercury arc lamp. High intensity peaks that occur at 365 nanometers and 405 nanometers and 436 nanometers are referred to as i-line and h-line and g-line.

Schematic of light being directed from the mask aligner lamp housing with the aid of a mirror through the condenser lens, filter, reducing lens, and front lens.

Operating Instructions

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Company

Model: MJB3 UV400 (SN 2131 mfg 4/88)

Name: Suss Microtek

Maskless Aligner – Durham Magneto Optics MicroWriter ML3 Pro

Maskless Aligner

Maskless aligner.

Overview

The maskless aligner uses light and a semiconductor chip with an array of micro-mirrors (each mirror is selectively turned on or off) to project a portion of the design layout pattern through optics and onto a photoresist coated substrate without the need for an expensive photomask

Features

  • 365nm and 405nm semiconductor light sources
  • Printing down to 0.6um
  • Accommodates standard and non-standard sample sizes
  • 230mm x 230mm x 15mm maximum wafer size
  • 195mm x 195mm maximum write area
  • X, Y interferometer with 1nm resolution for precise stage movement
  • Virtual mask aligner mode displays the design to be exposed over the microscope image

Specifications

See attached Data Sheet

Operating Instructions

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Ovens – Blue M

Oven – Lithography bake

Two convection ovens.

Overview

Gravity Convection Oven for use in photolithography, 38-260C

Features

  • Gravity Convection ovens for applications where a fan would disturb the thermal process; natural air convection supply through perforated stainless steel shelves to achieve temperature uniformity without blowers
  • Stainless steel interior with powder coated exterior for durability
  • Vertical-up gravity convection air flow allows for tighter temperature uniformity
  • Adjustable shelving provides flexible workspace configuration
  • 2 perforated shelves for increased air flow and uniformity
  • Independent and adjustable over-temperature protection provides extra assurance against damage to load and oven
  • Over-Temperature Protection

Specifications

  • Max Watts: 975
  • Voltage 50/60 Hz Single Phase: 120V.
  • Temperature Range: +38°C to +260°C (+100°F to +500°F)

Instructions

Door latch must swing fully to side to release door.

Company

Model: OV-12A

Name: BLUE M

Address: 2821 Old Route 15, New Columbus, PA 17856

Phone: 800-586-2473

Fax: 570-538-7380

Spinner – Specialty Coating Systems P6708D

Spin Coater

Spin coater.

Overview

Spin coater accurately applies uniform films of materials such as photoresist to planar substrates such as a silicon wafer. Typical film thicknesses range from hundreds of nanometers through hundreds of microns.

Features

  • Example Coating Materials: Photoresists, Polyimides, Metal-Organics, Dopants and Silica Films
  • Programmable Logic Controller: Stores up to 3 product recipes and offers three ramp-up and hold steps and one ramp-down for each recipe
  • Encoder allows vacuum chuck to be stopped at a Home position on programmable models
  • Chemically resistant Teflon coated bowl with integral drain
  • Hinged, interlocking cover on all models plus safety glass window on programmable models
  • Connected to house fume exhaust, vacuum, purge air

Specifications

  • Speed:100-8000 RPM
  • Acceleration/Deceleration: 1-30 sec
  • Spin Time: Up to 999 sec
  • Dispense times: 1-10 sec
  • Bowl Size: 8in
  • Weight: 52 lbs(123.6kg)
  • Power:120 VAC, 60Hz or 220 VAC, 50Hz
  • Vacuum Input: 430-635 mmHg/ 17-25in Hg
  • Purge Input: 0.55 scfm – at 2psi(N2 or Clean, dry air) 5psi maximum (external) OR 2.2 scfm @60 to 80 psi if using internal vacuum pump
  • Drain: 3/8″OD outlet at rear of machine
  • Dimensions (W x D x H): 13.25 x 17 x 12 in / 33.6 x 43.2 x x30.5cm

Instructions

See links below.
First program is reserved for standard photoresist spin profile, 900RPM for 5 seconds followed by 4000 RPM for 60 seconds.

Operating Instructions

SCS P-6708D Operating Instructions

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Specialty Coating Systems P-6708D User Manual

Company

Model: P-6708D

Name: Specialty Coating Systems

Address: 7645 Woodland Drive, Indianapolis, IN 46278-2707

Phone: 317-244-1200

Fax: 317-240-2073

Year of Purchase: 2011

Metrology

Contact Angle Goniometer – Rame Hart Model 190-F2

Contact Angle Goniometer

Contact Angle Goniometer.

Overview

Contact angle measurements for liquid droplets featuring computer aided droplet analysis

Features

  • Model 190 with DropImage CA software (angles but no surface energy or tension tools)
  • F2 series Camera IEEE1394a FireWire, 60 fps
  • Backlighting LED array Illuminator
  • Stage Precision 3-Axis Locking with
  • Leveling Specimen Stage
  • DROPimage Features Contact Angle Measurement Calibration Tool
  • Consumables Microsyringe Assy. 100-10-20

Needle 100-10-12-22 (other needles available

  • Options Environmental Fixture 100-07-60

Wafer Support (4?) 100-21-4 Software Upgrade 400-22-30 Manual Tilting Base 100-25-M Film Clamps 100-15

Specifications

  • Data Sheet
  • Stage Size 2 x 3 in (51 x 76mm)
  • Sample Size 3 in (76mm) deep x unlimited
  • Contact Angle Range 0 to 180°
  • Resolution 0.1°
  • Accuracy +/- 0.10°
  • Dimensions 19 x 20 x 10 in (480x500x250mm)
  • microsyringe volume per small division: 2 microliters
  • Weight 14 lbs / 6.3 kg (excluding power)
  • Power Supply 110 or 220 VAC

Instructions

Use included sphere to recalibrate if any of the optics are changed

Operating Instructions

Detailed Operating Instructions and Equipment Manuals (usually dynamic content)

Company

Model: 190

Name: Rame-hart Instrument Co

Address: PO Box 400, Netcong, NJ 07857

Phone: 973-448-0305

Ellipsometer – Gaertner Scientific L104B

Ellipsometer

Ellipsometer.

Overview

Ellipsometer measures thickness and refractive index of films on planar substrates. Ellipsometric parameters measured at two angles.

Features

  • Laser wavelength: 6328 Angstroms
  • Software uses ellipsometric angles to calculate t and n
  • Optimized for silicon dioxide and silicon nitride films, but generally useful

Specifications

  • Angle of Incidence: Fixed by user at a single incidence from 85° to 30° using alignment prism
  • Alignment Adjustments: ± 1/4 inch lateral shift both polarizer/analyzer ±6° angular adjustment which is diminished by the amount of ± 1/4 inch lateral adjustment used, i.e., if ± 1/8 inch lateral adjustment is used, i.e., ± 3 max angular adjustment is available
  • Sample/Specimen: Must be precisely located
  • Light Source: HeNe Laser 0.9mW power output
  • Light Beam Size: 1mm beam diameter
  • Software: Two Layer Transparent Program
  • Measurement Time: Under 1 second for single mode; 3 seconds for dual mode measurement
  • Computation Time: 3 seconds for HP9816S; 15 Seconds for HP85B
  • Accuracy: Thickness: ± 3A (over most of the measurement range) Index: ± .005 (over most of the measurement range)
  • Electrical Power (Vac): 100V, 115V, 220V, 230V, 240V
  • Dimensions: 14 X 33 X 43 cm
  • Weight: 17 lbs (7.7kg)

Operating Instructions

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Gaertner L104b User Manual

Internal Links – Protected

Gaertner L104b User Manual

Company

Model: L104B

Name: Gaertner Scientific

Email: info@cookevacuum.com

Address: 201 West Wrightwood Ave, Chicago, IL 60614

Phone: 312-281-5335

Year of Purchase: 1991

PO Number: P-60829

Profilometer – Tencor Alpha-step D500

Profilometer-Stylus D500

Profilometer.

Overview

The KLA Tencor D-500 is a stylus profilometer for accurate mapping of surface profiles and for precise measurement of thin-film thickness, with low force (.03mg) capability. 2, 5, and 12-micron radius probes.

Operating Instructions

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Company

Model: AlphaStep D-500

Name: Tencor Instruments

Address: 2426 Charleston Rd, Mt. View, CA 94043

Phone: 415-969-6767

Year of Purchase: 2020

Thermal Processing

Atmospheric Oxidation & Diffusion Furnaces – Thermco Minibrute

Diffusion Furnace

Stack of three oxidation furnaces.

Overview

Triple stack 4″ diameter tube diffusion furnaces for use at atmospheric pressure and temperatures between 400 and 1150C (1200C for short times). For processing 3″ silicon wafers.

Features

  • middle tube: thermal oxidation
  • bottom tube: boron doping
  • top tube (replaceable): other

Process gasses:

  • Oxygen
  • Water Vapor (bubbler)
  • Nitrogen
  • Argon
  • Forming gas flow are available

Flowmeter calibrated is for nitrogen; other gasses require a calculation

Instructions

See links below for oxide growth

NOTE: Furnaces should be kept at 400C when not in use. Cycle to room temperature only for HF etching of tube walls.

Operating Instructions

Company

Model: Furnace

Name: Thermco

Address: 1465 North Batavia St, Orange, CA 92668

Phone: 714-639-2340

Rapid Thermal Anneal – Solaris 100 RTP

Rapid Thermal Processor/Anneal

Rapid Thermal Anneal System.

Overview

The Solaris 100 RTP (or RTA=Rapid Thermal Anneal) can heat a silicon wafer to 1200C in seconds. It consists of a Heating chamber and a controller. The wafer to be heated is placed on 3 sharp pins on a quartz glass tray which slides into a quartz glass tube in the oven. Lamps above and below provide the source of energy for heating the wafer. The oven walls are covered with a reflective plating which decreases waste heat, and enhances uniformity and ramp-up speed. A K-type thermocouple on the wafer tray contacts the wafer and provides temperature measurement and feedback.

Features

Windows/LabView control computer

Specifications

Purge gases: argon, oxygen, forming gas
Wafer size: 3 or 4 inch

Detailed Operating Instructions and Equipment Manuals (Dartmouth ID required)

Company

Model: Solaris 100

Name: Surface Science Integration

Address: 580 North Bullard Ave Ste 69, Goodyear, Arizona 85338

Notes

Purchase cost split equally between Instruction and Prof. Liu research. CustomerRTP/RTP123

Cleanroom Room Floor Plan

Cleanroom floor plan.